Language
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PCB/FPC Laser Machine

Model

MS0404-V-B
DM300-IC
MS0305-RVT-A
PM11-B/PM11R-B/PM12-B
PM11-A

Cover Film Laser Cutting Machine MS0305-RV-A

Cover Film Laser Cutting Machine MS0305-RV-A
MS0305-RV-A_覆盖膜切割机(二代).538.png

Introduction

UV or Picosecnd laser cutting machine of cover film (single/double station) is mainly used for precision cutting of FPC, cover film and coil material in the 3C industry. The processing format is 300*500mm. The processing will not produce contact crushing, and the qualified rate of products is high; equipped with ultra-fast laser, the cutting affected area is small, and the processing effect is good

 

Inquiry

Sample

Cover film cutting
protective film cutting
PI protective film cutting
The heating film cutting
Parameter

Parameter

  • Modle
    MS0305-RV-A
  • Laser power(W)
    UV picosecond: 15
  • Working area (mm)
    300*500
  • Overall dimension(mm)
    1500*1800*22000
  • Accuracy (μm)
    ±20
  • X/Y Working platform
    Linear Motor
  • Base
    High precision marble
  • Cooling method
    Water cooling
  • Support format
    DXF etc.
  • Gross Power (kw)
    5.5
  • Working environment
    Temp: 10~35 ℃ Humidity :5~85% No condensation, no dust.

Feature

  • Imported UV laser generator: small light spot , exquisite marking , small heat effect, good cutting result of cover film laser cutting machine.
  • Imported digital high-speed mirror: small size , high speed, good stability.
  • High-precision linear motor and marble platform: high-speed& high-accuracy processing.
  • Professional laser cutting software system: user-friendly interface , easy to learn & operate。
  • Imported key components , excellent performance, stable quality, long life-span.
  • Non-contact processing, no mechanical stress and deformation, high product qualification rate
  • Any complex graphics can be processed, greatly shortening the delivery cycle
  • Automated and intelligent processing, saving labor costs and improving production efficiency
Relevant Model
×
Language
English 한국어 Pусский 日本語

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