IC Laser Decapsulation

Feature

• Double CCD high-definition vision system, real-time monitoring, recording and analysis of the processing process, and processing parameters can be set according to different local areas and materials;
• High-quality professional light source, stable power output, no damage to the base material, to ensure that the bottom material is intact during the opening process;
• Self-developed professional laser control system and software system,equipped with high precision high-speed oscillator, automatic stop of dew gold during processing, can achieve different depths and thickness of the chip sealing applications;
• Equipped with automatic lifting and focusing and precision fine-tuning loading platform, which is convenient for precision adjustment of workpiece position during processing and inspection;
• Fully enclosed design, protection grade IP54, strong dust-proof, dirt-proof water vapor-proof,fearless of harsh environments;
• Integrated design. small size. small space. easy to place. suitable for a variety of applications such as laboratories.